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Testing apparatus of bending reliability of flexible printed circuit board and bending test method using the same

机译:挠性印刷电路板的弯曲可靠性测试装置及使用其的弯曲测试方法

摘要

A testing device of bending reliability of a flexible substrate and a testing method using the same are provided to replace an interface substrate according to flexible substrates of various shapes by detachably connecting the interface substrate to the other end of the flexible substrate. A bottom board(120) is mounted on a base substrate(110). The bottom board fixes the other end of a flexible substrate. A top board(130) is mounted on the bottom board. The top board fixes one end of the flexible substrate. The top board performs a bending test of the flexible substrate through back and forth movement. A driving part(150) provides a driving force to the top board. A curvature control part(140) is positioned in one side of the bottom board. The curvature control part controls a gap between the top board and the bottom board by vertically moving the bottom board.
机译:提供一种挠性基板的弯曲可靠性的测试装置和使用该挠性可靠性的测试方法,以通过将界面基板可拆卸地连接到挠性基板的另一端,来根据各种形状的挠性基板更换界面基板。底板(120)安装在基础基板(110)上。底板固定柔性基板的另一端。顶板(130)安装在底板上。顶板固定柔性基板的一端。顶板通过来回移动来对柔性基板进行弯曲测试。驱动部(150)向顶板提供驱动力。曲率控制部(140)位于底板的一侧。曲率控制部分通过垂直移动底板来控制顶板和底板之间的间隙。

著录项

  • 公开/公告号KR100981607B1

    专利类型

  • 公开/公告日2010-09-10

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20080022160

  • 发明设计人 서승환;오선모;임재광;

    申请日2008-03-10

  • 分类号H05K13/08;

  • 国家 KR

  • 入库时间 2022-08-21 18:30:51

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