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Lead Frame and Electronic Device of Effective Thermal Emission Structure for Very Large Current Optical Source Lamp and Manufacturing Method Thereof
Lead Frame and Electronic Device of Effective Thermal Emission Structure for Very Large Current Optical Source Lamp and Manufacturing Method Thereof
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机译:大电流光源灯有效散热结构的引线框及电子装置及其制造方法
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摘要
PURPOSE: A lead frame for the mounting of the chip which has the effective heat radiation structure for the large area light source lamp, and an electric component and a manufacturing method thereof are provided to improve the light diffusion about the light emitted from the LED chip.;CONSTITUTION: PCB forms at least one penetration hole(21) and at least two electrode lead. A chip(90) is set up on the metal plate of the penetration hole area. A transparent resin(80) molds the surrounding of a chip with the predetermined fluorescence agent. At least one penetration hole for the chip mounting and at least two electrode leads(12) are formed on the front side of PCB. A metal coating layer(51/52) is formed on a metal layer(14) formed on an electrode lead(12) and a lead frame.;COPYRIGHT KIPO 2010
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