Fabricating multi-level metallic e.g. steel microstructure by UV photolithography and galvanic deposition, comprises covering conductive surface of substrate by first layer of photosensitive resin, and irradiating first layer through mask

摘要

The process comprises covering a conductive surface (2) of a substrate (1) by a first layer of photosensitive resin, irradiating the first layer of photosensitive resin through a mask (4) corresponding to the desired impression, developing the first photosensitive resin to dig openings and to obtain a first level of a resin mold, depositing a new layer of photosensitive resin on the developed resin layer to cover the resin layer and to refill the openings, and irradiating the new layer of photosensitive resin through a mask corresponding to the desired impression. The process comprises covering a conductive surface (2) of a substrate (1) by a first layer of photosensitive resin, irradiating the first layer of photosensitive resin through a mask (4) corresponding to the desired impression, developing the first photosensitive resin to dig openings and to obtain a first level of a resin mold, depositing a new layer of photosensitive resin on the developed resin layer to cover the resin layer and to refill the openings, irradiating the new layer of photosensitive resin through a mask corresponding to the desired impression, developing the new layer of photosensitive resin to dig openings to obtain a multi-level resin mold, galvanically depositing a metal or an alloy in the openings of the mold made of multi level resin, and eliminating the resin layers to produce a multi-level metal structure formed by the metal or alloy deposited in the openings. The openings in the first layer of resin define the conductive surface of the substrate. The conductive surface is formed: on the first layer of photosensitive resin before covering the conductive surface; on the remaining part of the surface of the resin layer after developing the first photosensitive resin; and at the bottom of the openings after developing the new photosensitive resin. An extra layer is added to the multi-level mold. The ignition layers are formed by a stack of chromium and gold layers. The resin and the deposited metal are leveled to bring the resin and multi-level structure to the same level. The first photosensitive resin is a solid resin applied by rolling.