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Flexible flat element for generating X-ray radiation, comprises adhesive mass layer having first and second adhesive mass side surfaces, covering layer bonded with first adhesive mass side surface, and carrier having carrier side surfaces
Flexible flat element for generating X-ray radiation, comprises adhesive mass layer having first and second adhesive mass side surfaces, covering layer bonded with first adhesive mass side surface, and carrier having carrier side surfaces
The flexible flat element comprises an adhesive mass layer having first and second adhesive mass side surfaces, a covering layer bonded with the first adhesive mass side surface in a continuous stick-slip manner, and a carrier having first and second carrier side surfaces. The covering layer has a relative permittivity, which differs itself from the relative permittivity of the adhesive mass layer to more than a value of 2 at a measurement frequency of 1 kHz and an ambient temperature of 23[deg] C. The carrier is fixedly connected with the second adhesive mass side surface. The flexible flat element comprises an adhesive mass layer having first and second adhesive mass side surfaces, a covering layer bonded with the first adhesive mass side surface in a continuous stick-slip manner, and a carrier having first and second carrier side surfaces. The covering layer has a relative permittivity, which differs itself from the relative permittivity of the adhesive mass layer to more than a value of 2 at a measurement frequency of 1 kHz and an ambient temperature of 23[deg] C. The carrier is fixedly connected with the second adhesive mass side surface at the first carrier side surface. The flat element is present as rolling wrapper, in which a first section of the flat element is directly arranged under second section of the flat element, where the second carrier side surface of the first section of the flat element is formed inside the rolling wrapper as covering layer of the other section of the flat element arranged over the first section. The covering layer and the carrier are separately formed. The difference in the relative permittivities of the adhesive mass layer and the covering layer is more than 8. The covering layer has a relative permittivity of more than 14. The adhesive mass layer has a relative permittivity of more than 5. The covering layer has a final layer at a side turned to the adhesive mass layer, where the final layer contains a high-k-dielectric. The adhesive mass layer and the covering layer have specific resistance of more than 10 10omega m at ambient temperature of 23[deg] C. The adhesive mass layer contains a basic polymer with a dynamical glass transition temperature of more than +10[deg] C at a frequency of 10 rad/seconds. The adhesive mass layer consists of an adhesive mass, which is formed as high-viscous pressure-sensitive adhesive mass and a stick slip adhesive mass, which has a stick slip strength of more than 75 on a steel substrate at a measurement temperature of 23[deg] C with a dissolution rate of 300 mm/minutes under a take-off angle of 90[deg] . The carrier has an anchoring layer, over which the carrier is bonded with the second adhesive mass side surface, at the first carrier side surface An independent claim is included for a method for generating X-rays.
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