Semiconductor component i.e. computer chip, producing method, involves providing substrate in distance from optical element, where distance between substrate and element corresponds to wavelength of optical radiation during exposure process

摘要

The method involves providing a substrate (3) in a distance from an optical element (1) of a projection lens, and providing an immersion fluid (2) in a region between the substrate and optical element. The substrate is exposed with optical radiation of a preset wavelength, and is laterally processed. The distance of the substrate from the optical element is increased with respect to a distance selected for the exposure process during processing of the substrate. The distance between the substrate and optical element corresponds to the wavelength of the radiation during the exposure process. An independent claim is also included for a projection exposure system comprising a projection lens.