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BASE DIVIDING DEVICE AND BASE DIVIDING METHOD

机译:基础划分装置和基础划分方法

摘要

PROBLEM TO BE SOLVED: To inhibit damage such as chips generated on the edge part of a hard base divided along a dividing line.;SOLUTION: This base dividing device X divides the hard base S with a split groove P of the lower surface formed along the dividing line D-D, parallel with the dividing line D-D. In addition, the base dividing device X comprises the following components: (1) a support rest 1 with the split groove P of the lower surface of the base S which is so arranged as to be positioned in the middle and also, with a first support part 11 and a second support part 12 which support the lower surface of the base S respectively in the direction where the dividing line D-D extends, and (2) a pressing member 3 which presses a position deviated from the center of the base S in he direction where the dividing line D-D extends, on the dividing line D-D of the upper surface of the base S.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:为了防止诸如在沿分割线分割的硬质基体的边缘部分上产生的切屑之类的损坏;解决方案:该基体分割装置X将硬质基体S与沿其形成的下表面的分割槽P分开。分界线DD,与分界线DD平行。另外,基座分割装置X包括以下部件:(1)支撑台架1,其具有基座S的下表面的开口槽P,该开口槽P布置成定位在中间,并且具有第一支撑部11和第二支撑部12分别在分割线DD的延伸方向上支撑基座S的下表面,以及(2)按压部件3,其按压从基座S的中心偏离的位置。分割线DD延伸的方向,在底座S的上表面的分割线DD上。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011152702A

    专利类型

  • 公开/公告日2011-08-11

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP;

    申请/专利号JP20100015427

  • 发明设计人 OZAWA SHINTARO;FUKUMARU TOSHIHIRO;

    申请日2010-01-27

  • 分类号B28D5/00;B26F3/00;C03B33/033;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:40

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