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RADIOGRAPHIC INSPECTION APPARATUS, RADIOGRAPHIC INSPECTION METHOD, AND RADIOGRAPHIC INSPECTION PROGRAM

机译:放射线检查设备,放射线检查方法和放射线检查程序

摘要

PROBLEM TO BE SOLVED: To provide a radiographic inspection apparatus, a radiographic inspection method, and a radiographic inspection program for deciding whether electric resistance of solder is appropriate.;SOLUTION: The radiographic inspection apparatus includes: a transmission amount acquisition means of acquiring an amount of transmission of radiation transmitted, in a lamination direction, through solder for joining a first joint surface and a second joint surface in the lamination direction; a reference thickness acquisition means of acquiring a reference thickness corresponding to distance between the first joint surface and the second joint surface in the lamination direction; a defect depth acquisition means of acquiring defect depth corresponding to depth of a defect existing in the solder, based on the transmission amount and the reference thickness; and a deciding means of deciding whether the solder is appropriate, based on a relative ratio of the defect depth to the reference thickness.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种放射线检查装置,放射线检查方法和放射线检查程序,用于确定焊料的电阻是否合适。沿层叠方向通过用于在层叠方向上接合第一接合面和第二接合面的焊料的辐射的透射率的图;参考厚度获取装置,其获取与第一接合面和第二接合面在层叠方向上的距离相对应的参考厚度。缺陷深度获取装置,基于透射量和基准厚度,获取与焊料中存在的缺陷的深度相对应的缺陷深度。一种基于缺陷深度与参考厚度的相对比来确定焊料是否合适的决定方法。版权所有:(C)2012,JPO&INPIT

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