首页> 外国专利> ETCHING SOLUTION FOR STRUCTURE OBSERVATION OF COPPER OR COPPER ALLOY, ETCHING METHOD AND STRUCTURE OBSERVATION METHOD

ETCHING SOLUTION FOR STRUCTURE OBSERVATION OF COPPER OR COPPER ALLOY, ETCHING METHOD AND STRUCTURE OBSERVATION METHOD

机译:铜或铜合金的结构观察的蚀刻溶液,蚀刻方法和结构观察方法

摘要

PROBLEM TO BE SOLVED: To provide an etching solution for structure observation with no special waste solution processing, usable as a micro corrosion etching solution and/or macro corrosion etching solution when observing a structure of a copper alloy with high oxidation sensitivity in which oxide formation tends to occur, high corrosion-resistant copper alloy, or high purity copper, high in safety of an ingredient, easy in handling or processing, without using special skill or expensive exclusive equipment, high in versatility, and with which a surface to be observed for clearly and easily observing a state of the structure or a crystal grain boundary is obtained.;SOLUTION: The etching solution for structure observation of copper or the copper alloy contains nitric acid, sulfuric acid, a copper sulfate salt, sodium hydroxide, and hydrogen peroxide as an initial composition for injecting into a bath.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种无需特殊废液处理即可用于结构观察的蚀刻液,当观察具有氧化敏感性的铜合金结构时,可以用作微腐蚀蚀刻液和/或宏观腐蚀蚀刻液。易于发生的是,高耐蚀性铜合金或高纯度铜,成分安全性高,易于处理或加工,无需使用特殊技能或昂贵的专用设备,通用性高,并且可以观察表面解决方案:用于观察铜或铜合金的结构的蚀刻液包含硝酸,硫酸,硫酸铜盐,氢氧化钠和氢,从而可以清晰,轻松地观察结构或晶界的状态。过氧化物作为注入浴液的初始成分。;版权所有:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP2010255063A

    专利类型

  • 公开/公告日2010-11-11

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20090108441

  • 发明设计人 TAKASHIMA TOSHIYUKI;

    申请日2009-04-27

  • 分类号C23F1/18;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:34

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