CONTINUOUS ELECTROLYTIC PLATING APPARATUS, CONTINUOUS ELECTROLYTIC PLATING METHOD AND METHOD OF PRODUCING METALIZED RESIN FILM

摘要

PPROBLEM TO BE SOLVED: To provide a continuous electrolytic plating apparatus and a continuous electrolytic plating method in which the occurrence of projection in a metal layer is suppressed in the deposition of the metal layer on a long substrate such as resin film with a metal thin film by continuous electrolytic plating. PSOLUTION: In the continuous electrolytic plating apparatus for electrolytic plating the long substrate F1 by immersing the long substrate F1 in a plating liquid 14 in a plating tank 13 provided with a plurality of anodes 15g, 15h and transporting the long substrate F1 to face respective anodes 15g, 15h, at least one of first nozzles 18g, 18h arranged 10 cm depth from the liquid level 14a of the plating liquid 14 and ejecting a plating liquid toward the long substrate F1 is provided between the long substrate F1 and at least one of the anodes 15g, 15h. PCOPYRIGHT: (C)2011,JPO&INPIT