首页> 外国专利> GOLD INLAYING METHOD AND HOUSING OF ELECTRONIC DEVICE INLAID WITH GOLD DECORATION MATERIAL BY THE SAME METHOD

GOLD INLAYING METHOD AND HOUSING OF ELECTRONIC DEVICE INLAID WITH GOLD DECORATION MATERIAL BY THE SAME METHOD

机译:金镶嵌方法和用金装饰材料嵌入电子设备的壳体的相同方法

摘要

PROBLEM TO BE SOLVED: To provide a gold inlaying method which enables inlay of a minute gold decoration material, provides high precision quality of gold decoration material inlay and provides the products of superb looks, and to provide a housing of electronic device inlaid with gold decoration material by the same method.;SOLUTION: The gold inlaying method includes: the step to provide a base board of metal material to which gold decoration material inlay is to be carried out, the step to form a recessed part of predetermined shape at a position on the surface of the base board where gold decoration material inlay is to be performed, the step to form a gold decoration material to correspond to the shape of the recessed part, the step to install metal wax at the bottom of the recessed part, the step to place the gold decoration material in the recessed part, the step to heat the base board on which the gold decoration material is placed, to melt the metal wax installed at the bottom of the recessed part, then to cool down the base board, and to fast joint the gold decoration material onto the base board.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种金镶嵌方法,该方法可以镶嵌微小的金装饰材料,提供高精度的金装饰材料镶嵌,并提供精美的产品,并提供一种镶嵌有金装饰的电子设备的外壳解决方法:金镶嵌方法包括:提供金属材料基板的步骤,要在其上镶嵌金装饰材料;在某一位置形成预定形状的凹陷部分的步骤。在要进行金装饰材料镶嵌的基板表面上,形成与凹陷部分的形状相对应的金装饰材料的步骤,在凹陷部分的底部安装金属蜡的步骤,步骤:将金装饰材料放置在凹进部分中;加热在上面放置金装饰材料的基板的步骤;融化安装在底部的金属蜡; f凹陷的部分,然后冷却基板,并将金装饰材料快速接合到基板上。;版权所有:(C)2011,JPO&INPIT

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