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GOLD INLAYING METHOD AND HOUSING OF ELECTRONIC DEVICE INLAID WITH GOLD DECORATION MATERIAL BY THE SAME METHOD
GOLD INLAYING METHOD AND HOUSING OF ELECTRONIC DEVICE INLAID WITH GOLD DECORATION MATERIAL BY THE SAME METHOD
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机译:金镶嵌方法和用金装饰材料嵌入电子设备的壳体的相同方法
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摘要
PROBLEM TO BE SOLVED: To provide a gold inlaying method which enables inlay of a minute gold decoration material, provides high precision quality of gold decoration material inlay and provides the products of superb looks, and to provide a housing of electronic device inlaid with gold decoration material by the same method.;SOLUTION: The gold inlaying method includes: the step to provide a base board of metal material to which gold decoration material inlay is to be carried out, the step to form a recessed part of predetermined shape at a position on the surface of the base board where gold decoration material inlay is to be performed, the step to form a gold decoration material to correspond to the shape of the recessed part, the step to install metal wax at the bottom of the recessed part, the step to place the gold decoration material in the recessed part, the step to heat the base board on which the gold decoration material is placed, to melt the metal wax installed at the bottom of the recessed part, then to cool down the base board, and to fast joint the gold decoration material onto the base board.;COPYRIGHT: (C)2011,JPO&INPIT
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