首页> 外国专利> The headphone which is superior in the sound quality and the timbre

The headphone which is superior in the sound quality and the timbre

机译:音质和音质优异的耳机

摘要

Topic Both the sound quality and the timbre the headphone which is superior is offered.SolutionsThis headphone year pad 5, cover 4, housing 1, is formed with hanger 2 and speaker 3. Speaker 3 provides hemispherical surface form diaphragm 6 above speaker coil 10. In hemispherical surface form diaphragm 6 the cover hemispherical surface and the cover hemispherical surface 8 are provided above, through bridge 12, the cover hemispherical surface and the cover hemispherical surface 8 and cover 4 is made to concatenate. The hole 9 where the sound of one or more appears in on the cover hemispherical surface 8 is bored. Hemispherical surface form diaphragm the opening of 6 and the cover hemispherical surface makes 0.3mm - 1.5mm, hole diameter of the hole 9 where sound comes out makes 0.2mm - 10mm. Not only being able to change rendering the sound, can also adjust the sound of medium high pass, the impulse noise overpressure of medium high pass can adjust above 1dB. Choice figure Drawing 2
机译:解决方案此耳机年垫5,盖4,外壳1由衣架2和扬声器3形成。扬声器3在扬声器线圈上方提供半球形表面膜片6 10.在半球形表面膜片6中,盖半球形表面和盖半球形表面8设置在上方,通过桥12,盖半球形表面与盖半球形表面8和盖4连接在一起。在盖半球表面8上钻有一个或多个声音的孔9。半球形表面形成振动膜6的开口,盖的半球形表面为0.3mm〜1.5mm,发出声音的孔9的孔径为0.2mm〜10mm。不仅可以改变渲染声音,还可以调节中高通的声音,中高通的脉冲噪声超压可以调节在1dB以上。<选择图>图2

著录项

  • 公开/公告号JP3171553U

    专利类型

  • 公开/公告日2011-11-04

    原文格式PDF

  • 申请/专利权人 惠陽東美音響制品有限公司;

    申请/专利号JP20110005010U

  • 发明设计人 朱銘忠;

    申请日2011-08-26

  • 分类号H04R1/10;H04R1/22;

  • 国家 JP

  • 入库时间 2022-08-21 18:23:45

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号