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COMPONENT FOR MICROCHANNEL CHIP, MICROCHANNEL CHIP AND ANALYZER

机译:微通道芯片,微通道芯片和分析仪的组件

摘要

PROBLEM TO BE SOLVED: To provide a component for microchannel chips in which a second resin substrate to be a lid can be positioned with high accuracy, superimposed, and jointed to a first substrate on which fine grooves are machined in the manufacture of a microchannel chip, and to provide a microchannel chip and an analyzer.;SOLUTION: The component for microchannel chips includes the first resin substrate in which a groove for a first channel is formed in one surface; the second resin substrate in which a groove for a second channel is formed in one surface, and a connecting section for rotatably connecting the first resin substrate and the second resin substrate to each other. The first resin substrate, the second resin substrate, and the connection section are formed integrally; and the surface of the first resin substrate in which the groove for the first channel is formed and the surface of the second resin substrate in which the groove for the second channel is formed can be folded via the connection part, in such a way as to be brought into contact with each other.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种用于微通道芯片的组件,在该微通道芯片中,作为盖的第二树脂基板可以高精度定位,叠置并接合到在微通道芯片的制造中机加工有细槽的第一基板上解决方案:用于微通道芯片的部件包括:第一树脂基板,在该第一树脂基板的一个表面上形成有用于第一通道的凹槽;以及第一树脂基板。第二树脂基板在其一个表面上形成有用于第二通道的凹槽,以及用于将第一树脂基板和第二树脂基板彼此可旋转地连接的连接部。第一树脂基板,第二树脂基板和连接部一体形成。并且,第一树脂基板的形成有第一通道的槽的表面和第二树脂基板的形成有第二通道的槽的表面可以经由连接部折叠,使得相互接触。;版权所有:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP2011123000A

    专利类型

  • 公开/公告日2011-06-23

    原文格式PDF

  • 申请/专利权人 SUMITOMO BAKELITE CO LTD;

    申请/专利号JP20090282545

  • 发明设计人 SAITO SHIN;AKAMINE AKINORI;ARAI SUSUMU;

    申请日2009-12-14

  • 分类号G01N35/08;G01N37/00;B01J19/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:23:33

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