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MASTER DIE, METHOD OF PREPARING MASTER AND THE MASTER

机译:母模,母模的制备方法和母模

摘要

PROBLEM TO BE SOLVED: To provide a master die and a method of preparing the same capable of preventing protrusion of a material and enabling transfer with high accuracy when a master of a forming die for forming an optical element is prepared.;SOLUTION: To prepare a formed body in which a formation part having a shape of the optical element is formed on the surface of a substrate part 1, this master die corresponds to the shape of the formed body. The die includes a die face forming a shape of an object part corresponding to the formation part by deforming an object material made of resin on the surface of a substrate 31 constituting the master. The die face includes: a transfer part 21 transferring a shape equivalent to an optical face of the optical element; a plane part 20a formed of a plane opposing to the substrate 31; and a resin storage recessed part 22 formed by surrounding the transfer part 21 between the transfer part 21 and the plane part 20a and constituting a space storing the object material which cannot be stored in a space between the transfer part 21 and the surface of the substrate 31. Wet performance with respect to resin 10R on the surface of the transfer part 21 is set higher than that with respect to the resin 10R on the surface of the resin storage recessed part 22.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种母模及其制备方法,当制备用于形成光学元件的成形模的母模时,该母模及其制备方法能够防止材料突出并能够高精度地转印。在基体部分1的表面上形成有具有光学元件形状的形成部的成形体的情况下,该原模与成形体的形状相对应。模具包括通过在构成母模的基板31的表面上使由树脂制成的目标材料变形而形成与形成部分相对应的目标部分的形状的模具面。模具面包括:转印部21,其转印与光学元件的光学面等效的形状;以及转印部21。平面部20a由与基板31相对的平面形成。树脂收纳凹部22,其通过在转印部21与平面部20a之间包围转印部21而构成,并构成在该转印部21与基板的表面之间的空间中收纳不能收纳的目标材料的空间。 31.相对于转印部21的表面上的树脂10R的润湿性能被设定为比相对于树脂收纳凹部22的表面上的树脂10R的润湿性能高。版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011104811A

    专利类型

  • 公开/公告日2011-06-02

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20090259965

  • 发明设计人 NAKAO KAZUHIRO;

    申请日2009-11-13

  • 分类号B29C33/38;B29C59/02;G02B3/00;B29L11/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:23:18

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