首页> 外国专利> CLAD SUBSTRATE, PHOTOELECTRIC CONVERSION DEVICE, THIN-FILM SOLAR CELL MODULE, METHOD OF MANUFACTURING THE CLAD SUBSTRATE, AND METHOD OF MANUFACTURING THE THIN-FILM SOLAR CELL MODULE

CLAD SUBSTRATE, PHOTOELECTRIC CONVERSION DEVICE, THIN-FILM SOLAR CELL MODULE, METHOD OF MANUFACTURING THE CLAD SUBSTRATE, AND METHOD OF MANUFACTURING THE THIN-FILM SOLAR CELL MODULE

机译:覆层基板,光电转换设备,薄膜太阳能电池模块,制造覆层基板的方法以及制造薄膜太阳能电池模块的方法

摘要

PPROBLEM TO BE SOLVED: To provide a clad substrate for forming a safe and low-cost insulating layer having improved quality of heat resistance properties, insulation properties, or the like, and to provide a method of manufacturing the clad substrate, to provide a photoelectric conversion device and a thin-film solar cell module using the clad substrate, and to provide a method of manufacturing the thin-film solar cell module. PSOLUTION: The clad substrate includes a strip of substrate made of metal, a first metal material that is provided on the surface of the substrate and is wider than the substrate, and a second metal material that is provided on the back of the substrate and is wider than the substrate. The first metal material and the second metal material are crimped to the substrate to cover the substrate. In the first metal material and the second metal material, the peripheries are bonded. PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:提供一种用于形成安全且低成本的绝缘层的包覆基板,该包覆层基板具有改善的耐热特性,绝缘特性等的质量,并且提供一种制造该包覆基板的方法,本发明提供一种光电转换装置和使用包覆基板的薄膜太阳能电池模块,并提供一种薄膜太阳能电池模块的制造方法。

解决方案:覆层基板包括由金属制成的基板条,设置在基板表面上且比基板宽的第一金属材料以及设置在基板背面的第二金属材料。基材并且比基材宽。将第一金属材料和第二金属材料压接到基板上以覆盖基板。在第一金属材料和第二金属材料中,外围被结合。

版权:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP2011077246A

    专利类型

  • 公开/公告日2011-04-14

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20090226270

  • 发明设计人 KUBO YASUSHI;GOTO CHIAKI;

    申请日2009-09-30

  • 分类号H01L31/04;

  • 国家 JP

  • 入库时间 2022-08-21 18:22:31

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