Electronic device including electronic circuit structure, the structure, thermoelectric power generation method, the auxiliary power generation method, and semiconductor bare chip

摘要

PROBLEM TO BE SOLVED: To reduce an electric power consumption of electronic equipment with a semiconductor bare chip used, and to simplify a cooling means.;SOLUTION: A thermo-electoromotive force is generated by a thermoelectric conversion element layer 4 formed in the inside of a semiconductor bare chip 1 correpsonding to the temperature difference between a heat sink 2 and an integrated circuit layer 3 on the basis of the Seebeck effect, the thermo-electromotive force is converted to the predetermined power voltage by a power converter 7, and the power voltage is resolved and applied to the layer 3 within the chip 1 through a PWB 6. Consequently, the thermo-electromotive force generated in the layer 4 behaves as an auxiliary power source of the power section, and the power consumption of the electronic equipment is reduced. Further, a part of the heat generated from the chip 1 is converted to the power by the layer 4 to decrease the amount of heat radiated through the heat sink 2, providing relatively small heat sink 2 and a motor fan, which simplifies a structure of the cooling means.;COPYRIGHT: (C)2007,JPO&INPIT