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The system and method of the link processing by nanosecond laser pulses and ultrafast laser pulse
The system and method of the link processing by nanosecond laser pulses and ultrafast laser pulse
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机译:纳秒级激光脉冲和超快激光脉冲进行链接处理的系统和方法
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摘要
Systems and methods for processing an electrically conductive link in an integrated circuit use a series of laser pulses having different pulse widths to remove different portions of a target structure without substantially damaging a material underlying the electrically conductive link. In one embodiment, an ultrafast laser pulse or bundle of ultrafast laser pulses removes an overlying passivation layer in a target area and a first portion of link material. Then, a nanosecond laser pulse removes a second portion of the link material to sever an electrical connection between two nodes in the integrated circuit. The nanosecond laser pulse is configured to reduce or eliminate damage to the underlying material.
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