Especially, the substrate in mannered null optics, electronics or the photoelectron engineering which produce

摘要

The invention relates to a method for fabricating substrates (30), in particular for optics, electronics, or optoelectronics, by transferring a layer (170) of a material suitable for said type of application, and in particular a semiconductor material, onto a support (20). Said method is characterized in that it comprises the following steps : a) forming a flat face (13) termed the "front face" on a raw ingot (10) of material intended to form said layer (170); b) implanting atomic species beneath said front face (13) to a controlled mean implantation depth to create a zone of weakness (16) defining a top layer (17) of said ingot (10 ); c) bonding a support (20) onto said front face (13); d) directly detaching from the ingot (10), at the zone of weakness (16), the portion (170) of said top layer (17) which is bonded to said support (20); and e) re-commencing said cycle of operations from step b) at least once. Said method saves starting material.