The production mannered null substrate of the formation which is demarcated with respect to the hybrid

摘要

The present invention provides a manufacturing method of the layer to be defined to the hybrid circuit. Elements have a single circuit (22) and at least (20) substrate, said circuit element comprises a second facet and the first, the hybrid circuit, the facets of the substrate through the facet of the second It is a hybrid of it for. In accordance with the present invention, the coated thin layer (24), wherein the first layer is removed from the first facet of the element circuits, the element circuit and each of the facets of the substrate, said first facets covered by (28) the second layer, the second layer covering it with part of the present, moieties present in the first layer is removed. Application of the invention is to obtain a metal layer or an antireflection layer on the chip.