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Being dry manner of dry manner of the substrate

机译:基材的干燥方式为干燥方式

摘要

PROBLEM TO BE SOLVED: To provide a drying device of saved power and space for drying substrates, with no residue after drying, requiring no cooling process after drying.;SOLUTION: A first reactor A is provided on the upper stream side in transportation direction of a processed substrate W, with a second reactor B provided on its lower stream side. The reactors A and B comprise a surface processing device which supplies the processed substrate W with reactive gas made into plasma. The first reactor A is supplied with such reactive gas as modifying the surface of the processed substrate W when made into plasma, and the second reactor B is supplied with such reactive gas as containing components for dissociating water molecule and organics when made into plasma. Thus, in the first reactor A, the water content sticking to the surface of processed substrate W is modified to weaken the surface tension force of water drops, and in the second reactor B, the water molecule in the surface of water drop is dissociated, and organics are decomposed for drying substrates.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种节省功率和空间的干燥装置,用于干燥基板,干燥后没有残留物,干燥后不需要冷却过程。解决方案:第一反应器A沿输送方向设置在上游侧。处理后的基板W,在其下游侧设有第二反应器B。反应器A和B包括表面处理装置,该表面处理装置向被处理的基板W供应被制成等离子体的反应气体。向第一反应器A供应诸如当被制成等离子体时改性处理的基板W的表面的反应性气体,并且向第二反应器B供应诸如当被制造成等离子体时包含用于离解水分子和有机物的成分的反应性气体。因此,在第一反应器A中,对附着在被处理基板W的表面上的水分进行改性,以减弱水滴的表面张力,在第二反应器B中,水滴表面中的水分子解离, ;有机物被分解以干燥基材。;版权所有:(C)2007,日本特许厅

著录项

  • 公开/公告号JP4662453B2

    专利类型

  • 公开/公告日2011-03-30

    原文格式PDF

  • 申请/专利权人 株式会社イー・スクエア;

    申请/专利号JP20050120788

  • 发明设计人 高島 賢二;

    申请日2005-04-19

  • 分类号H01L21/304;B08B7/00;F26B5/14;H05H1/24;

  • 国家 JP

  • 入库时间 2022-08-21 18:17:32

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