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The field board and the suffering

机译:现场委员会和苦难

摘要

PROBLEM TO BE SOLVED: To produce a high-density recording medium having fine uneven pattern, a semiconductor, and a magnetic recording medium in a high throughput and in a high yield.;SOLUTION: In a method for producing a plate-shaped structure including a process in which an original board 5 having an unevenness forming area with an uneven pattern formed and a substrate 1 for transfer are held between a pair of the press surfaces of a mold composed of a hollow, cylindrical upper mold 9 and a lower mold 10 and pressurized by pressurizing the central parts of the upper and lower molds 9 and 10 to transfer the uneven pattern of the original board 5 onto the surface of the substrate 1, compressive loads applied to the interior parts of the upper and lower molds 9 and 10 are intercepted to disperse the loads to the peripheral sides of the upper and lower molds 9 and 10.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:以高产量和高产量生产具有精细凹凸图案的高密度记录介质,半导体和磁记录介质;解决方案:一种用于制造板状结构的方法,包括在具有中空圆筒状的上模具9和下模具10的模具的一对按压面之间,夹持形成有形成有凹凸图案的凹凸形成区域的原始基板5和转印用基板1的工序。然后通过对上下模具9和10的中央部分加压以将原始板5的不平坦图案转印到基板1的表面上来加压,从而将压缩载荷施加到上下模具9和10的内部上被截取以将载荷分散到上下模具9和10的周边;版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4718946B2

    专利类型

  • 公开/公告日2011-07-06

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20050271119

  • 发明设计人 高橋 良一;櫻井 正敏;

    申请日2005-09-16

  • 分类号B29C59/02;G11B5/84;B29L7/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:17:08

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