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The copper alloy bar for the electronic equipment which is superior in heat dissipation Characteristic and resin adhesion
The copper alloy bar for the electronic equipment which is superior in heat dissipation Characteristic and resin adhesion
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机译:电子设备用铜合金棒,具有优异的散热特性和树脂附着力
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摘要
PROBLEM TO BE SOLVED: To provide a Cu-Fe-P-based copper alloy thin plate having good resin adhesion and suited to be used as a heat dissipation board in chip-on-board of an LED chip or the like capable of efficiently dissipating heat.SOLUTION: A copper alloy strip material contains 1.5 to 2.4 mass% of Fe, 0.008 to 0.08 mass% of P, 0.01 to 0.5 mass% of Zn and a remainder composed of Cu and inevitable impurities. In the copper alloy strip material: orientation density of a cube orientation measured by an EBSD method in a crystal structure of a depth range up to 10 μm from the surface of the copper alloy strip material is 10 to 20%; an average crystal grain size measured by the EBSD method is 12 to 20 μm; a maximum height Rz of a surface of a portion obtained by roughening the surface of the copper alloy strip material by a surface treatment agent is 1.0 to 2.0 μm; arithmetic mean roughness Ra of a surface of a portion which is not roughened is 0.02 to 0.05 μm; a maximum height Rz of the surface of the portion which is not roughened is 0.20 to 0.40 μm; and a ratio Rq/Rz of root mean square roughness Rq to the maximum height Rz is 0.10 to 0.25.
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