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METHODS FOR SUBSTRATE SURFACE PLANARIZATION DURING MAGNETIC PATTERNING BY PLASMA IMMERSION ION IMPLANTATION
METHODS FOR SUBSTRATE SURFACE PLANARIZATION DURING MAGNETIC PATTERNING BY PLASMA IMMERSION ION IMPLANTATION
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机译:等离子体浸没离子注入磁化过程中基体表面平面化的方法
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摘要
A method and apparatus for planarizing magnetically susceptible layers of substrates is provided. A patterned resist is formed on the magnetically susceptible layer, and the substrate is subjected to a plasma immersion ion implantation process to change a magnetic property of the magnetically susceptible layer according to the pattern of the resist material. The substrate is subjected to a plasma material removal process either before or after the implantation process to planarize the surface of the magnetically susceptible layer resulting from the implantation process. The plasma material removal process may be directional or non-directional.
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