Fracture prediction for crystalline microstructures

摘要

A method for predicting failures in crystalline microstructures is described. Fracture stress distribution data obtained from test samples prepared according to the same manufacturing process as a contemplated device is used to characterize the strength of surfaces in a numerical stress analysis of the device. The reliability is then calculated for surface nodes on the device. The product of all such reliabilities yields the overall reliability (or 1—the overall failure probability) of the device.