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Sb-Te alloy powder for sintering, sintered compact sputtering target obtained by sintering said powder, and manufacturing method of Sb-Te alloy powder for sintering

机译:用于烧结的Sb-Te合金粉末,通过将所述粉末烧结而获得的烧结的紧凑溅射靶以及用于烧结的Sb-Te合金粉末的制造方法

摘要

Provided is Sb—Te alloy powder for sintering in which the maximum grain size of the powder obtained by subjecting gas atomized powder of an Sb—Te alloy to mechanical pulverization is 90 μm or less, and a sintered compact sputtering target obtained by sintering this powder. Further provided is a manufacturing method of Sb—Te alloy powder for a sintered compact sputtering target including the steps of dissolving an Sb—Te alloy, thereafter subjecting this to gas atomization to obtain atomized powder, and further subjecting this to mechanical pulverization in an inert atmosphere without any atmospheric exposure so as to manufacture powder having a maximum grain size of 90 μm or less and reduced oxygen content. Thus, the Sb—Te alloy sputtering target structure can be uniformalized and refined, generation of cracks in the sintered target can be inhibited, and generation of arcing during sputtering can be inhibited. Further, surface ruggedness caused by sputter erosion can be reduced in order to obtain a high quality Sb—Te alloy sputtering target.
机译:提供一种用于烧结的Sb-Te合金粉末,其中,通过对Sb-Te合金的气体雾化粉末进行机械粉碎而获得的粉末的最大粒径为90μm以下,以及通过对该粉末进行烧结而获得的烧结体溅射靶。 。还提供了一种用于烧结体溅射靶的Sb-Te合金粉末的制造方法,该方法包括以下步骤:溶解Sb-Te合金,然后对其进行气体雾化以获得雾化的粉末,并且进一步使其在惰性条件下机械粉碎。在大气中不暴露于任何空气,从而制造最大粒径为90μm或更小且氧含量降低的粉末。因此,可以使Sb-Te合金溅射靶的组织均匀且微细,可以抑制烧结靶的裂纹的产生,并且可以抑制溅射时的电弧的产生。此外,可以降低由溅射腐蚀引起的表面粗糙度,以获得高质量的Sb-Te合金溅射靶。

著录项

  • 公开/公告号US7947106B2

    专利类型

  • 公开/公告日2011-05-24

    原文格式PDF

  • 申请/专利权人 HIDEYUKI TAKAHASHI;

    申请/专利号US20050813694

  • 发明设计人 HIDEYUKI TAKAHASHI;

    申请日2005-11-29

  • 分类号B22F1/00;C23C14/32;

  • 国家 US

  • 入库时间 2022-08-21 18:10:26

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