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Composite plate comprising carbon nanotube bundles with high thermal conductivity and method for making the same

机译:包含具有高导热率的碳纳米管束的复合板及其制造方法

摘要

A composite plate comprising CNT bundles with high thermal conductivity is formed by the method comprising preparing a CNT growth substrate, depositing a CNT growth catalyst on the CNT growth substrate, preparing a wafer with etched through via arrays, placing the wafer with the etched through via arrays over the CNT growth substrate with the CNT growth catalyst, growing CNT bundles in the etched through via arrays on the wafer over the CNT growth substrate with the CNT growth catalyst in a CVD chamber to form a wafer matrix CNT composite structure; and removing the CNT growth substrate from the wafer matrix CNT composite structure. The formed composite plate comprising CNT bundles with high thermal conductivity has improved CTE silicon match, has a more effective thermal conductivity than a silicon matrix or Cu or Cu alloy substrate, and contains nanotubes that remain vertical.
机译:通过以下方法形成包括高导热率的CNT束的复合板,该方法包括:制备CNT生长基板;在CNT生长基板上沉积CNT生长催化剂;制备具有蚀刻过的通孔阵列的晶片;放置具有蚀刻过的通孔的晶片。在具有CNT生长催化剂的CNT生长基板上排列阵列,并在CVD室中利用CNT生长催化剂在CNT生长基板上方的晶片上的蚀刻通孔阵列中生长CNT束,以形成晶片基质CNT复合结构;从晶片基质CNT复合结构中去除CNT生长衬底。所形成的包含具有高导热率的CNT束的复合板具有改进的CTE硅匹配度,比硅基质或Cu或Cu合金基板具有更有效的导热率,并且包含保持垂直的纳米管。

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