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Method, system, and computer program product for predicting thin film integrity, manufacturability, reliability, and performance in electronic designs
Method, system, and computer program product for predicting thin film integrity, manufacturability, reliability, and performance in electronic designs
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机译:用于预测电子设计中的薄膜完整性,可制造性,可靠性和性能的方法,系统和计算机程序产品
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摘要
Disclosed is an improved method, system, and computer program product for predicting and improving the integrity, manufacturability, reliability, and performance of an electronic circuit feature based on the stresses or strains of design features of electronic designs. Some embodiments identify the design, the concurrent model(s), design feature physical or electrical parameters or attributes, analyzes the stresses or strains to predict the integrity of the design and determines whether the design meets the design objectives or constraints. Some other embodiments make corrections to the designs or the processes based upon the determination of whether the design meets the design objectives or constraints. Some other embodiments compute the variations of the design features as a result of the stresses or strains and determine their impact on the subsequent processes.
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