Soluu00c7u00e7o poliamidaimida resin, its use to prepare glaze for enamel wires, wires and use it, as well as enameled wire and its process of produu00c7u00e7o.

公开/公告号BR0113504B1

专利类型

公开/公告日2011-06-14

原文格式PDF

申请/专利号BR20010113504

申请日2001-08-27

分类号C08G18/10;C08G73/14;C08G18/34;C08G18/76;C08G18/80;C08L79/08;C09D5/25;C09D179/08;H01B7/00;H01B7/02;H01B13/00;H01B13/16;

国家 BR

入库时间 2022-08-21 18:07:22