A TERMINAL OBTAINED BY FORMING A SURFACE LAYER FORMED OF A SN-AG-CU TERNARY ALLOY WITH ELECTROPLATING ON A WHOLE SURFACE OR A PORTION OF A CONDUCTIVE BASE

摘要

A terminal obtained by forming a surface layer formed of a Sn-Ag-Cu ternary alloy with electroplating on a whole surface or a portion of a conductive base; wherein said Sn-Ag-Cu ternary alloy is constructed with a ratio of 70-99.8 mass % of Sn, 0.1-15 mass % of Ag and 0.1-15 mass % of Cu, has a melting point of 210-230 ° C, and is formed in a state of a crystal of a minute particle as compared with said surface layer formed of Sn alone.