A LIQUID THERMOSETTING EPOXY RESIN COMPOSITION CONTAINS A BASE RESIN IN COMBINATION WITH A CURING AGENT AND A CURING ACCELERATOR OR WITH A CURING CATALYST. THE BASE RESIN INCLUDES A CYCLOALIPHATIC EPOXY COMPOUND HAVING AT LEAST ONE ALICYCLIC SKELETON AND TWO OR MORE EPOXY GROUPS PER MOLECULE, AND A POLYOL OLIGOMER HAVING TWO OR MORE TERMINAL HYDROXYL GROUPS. AN OPTICAL SEMICONDUCTOR DEVICE INCLUDES AN OPTICAL SEMICONDUCTOR ELEMENT SEALED BY USING THE LIQUID THERMOSETTING EPOXY RESIN COMPOSITION. THE COMPOSITION YIELDS A CURED RESINOUS PRODUCT WHICH IS FREE FROM CURING FAILURE, IS OPTICALLY HOMOGENOUS, HAS A LOW ELASTIC MODULUS IN BENDING, A HIGH BENDING STRENGTH, A HIGH GLASS TRANSITION TEMPERATURE, A HIGH OPTICAL TRANSPARENCY AND IS USEFUL FOR OPTICAL SEMICONDUCTORS
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