首页> 外国专利> MEMBERSHIP UNION PROCEDURE FOR HEAT FUSION WITHOUT ADHESIVE.

MEMBERSHIP UNION PROCEDURE FOR HEAT FUSION WITHOUT ADHESIVE.

机译:无需粘合的热熔会员程序。

摘要

A method for attaching a membrane (3) to a substrate (1), which comprises the steps of: (a) providing a substrate (1) that has an upper surface (1A) and a bottom surface (1B) apart from each other. , and a receptacle (2) between them; (b) inserting a mandrel (4) into said receptacle (2), mandrel that is configured to the internal dimensions of the receptacle (2) to avoid excessive deformation of the substrate (1) inside the receptacle (2); (c) placing a membrane (3) comprising a polymer composition (3B) combined with a support structure (3A) along said upper surface (1A) of said substrate (1) on said receptacle (2), said support structure (3A) being a woven mesh-like construction having a reticular structure with openings or open areas therein to capture the polymer material (3B); (d) cause the union between the substrate (1) and the membrane (3) by application of heat by conductivity to the side of the membrane (3) opposite the substrate (1) by means of a conductive means (5), heating stage by conductivity further comprising: - placing said conductive means (5) on said membrane (3) covering said conductive means (5) said membrane (3), and contacting said conductive means (5) with a heat source (6) during the time required to melt said substrate (1) to the molten state forming a molten substrate (1), molten substrate that flows to said support structure (3A) of said membrane (3) and displaces a portion of said polymer composition (3B) of said support structure (3A); and (e) allowing said substrate (1) to cool to result in a heat-bonded entanglement (7) between said substrate (1) and said membrane.
机译:一种将膜片(3)附着到基板(1)上的方法,该方法包括以下步骤:(a)提供基板(1),该基板(1)具有彼此分开的上表面(1A)和底表面(1B)。 。 ,以及它们之间的插座(2); (b)将心轴(4)插入到所述容器(2)中,该心轴构造成容器(2)的内部尺寸,以避免衬底(1)在容器(2)内部过度变形; (c)将包含聚合物组合物(3B)和支撑结构(3A)的膜(3)沿着所述基板(1)的所述上表面(1A)放置在所述容器(2)上,所述支撑结构(3A)为具有网状结构的编织网状结构,其中具有开口或开口区域以捕获聚合物材料(3B); (d)通过利用导电装置(5)通过传导性对膜(3)的与基底(1)相对的一侧施加导电性的热量,来引起基底(1)和膜(3)之间的结合。通过导电的阶段进一步包括:-将所述导电装置(5)放置在覆盖所述导电装置(5)的所述膜(3)上的所述膜(3)上,并且在加热期间使所述导电装置(5)与热源(6)接触。将所述基材(1)熔化成熔融状态(形成熔融基材(1))所需的时间,熔融基材流到所述膜(3)的所述支撑结构(3A)并置换一部分所述聚合物组合物(3B)。所述支撑结构(3A); (e)使所述基片(1)冷却以在所述基片(1)和所述膜之间产生热粘合的缠结(7)。

著录项

  • 公开/公告号ES2367303T3

    专利类型

  • 公开/公告日2011-11-02

    原文格式PDF

  • 申请/专利权人 BECTON DICKINSON AND COMPANY;

    申请/专利号ES20040029416T

  • 发明设计人 HEATH MICHAEL;PERREAULT MARK;

    申请日2004-12-13

  • 分类号B01L3;G01N35/02;B01D29;B01D39/16;B01D65;B01J19;C40B60/14;

  • 国家 ES

  • 入库时间 2022-08-21 18:02:34

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