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METHOD OF THREE-DIMENSIONAL MICROFABRICATION AND HIGH-DENSITY THREE-DIMENSIONAL FINE STRUCTURE

机译:三维微细化和高密度三维精细结构的方法

摘要

Surface of a thin film formed on a surface of substrate of AlxGayIn1-x-yAszP1-z (0≤x≤1, 0≤y and z≤1) including simple substances GaAs and InP is irradiated with electron beams controlled at any arbitrary electron beam diameter and current density so as to cause any natural oxide film formed on GaAs surface to undergo selective Ga2O3 substitution or formation. Thereafter, the temperature of the substrate is adjusted to given temperature so as to effect detachment of the natural oxide film at region other than that of Ga2O3 substitution. Selective growth of a Group III-V compound semiconductor crystal is carried out on the substrate on its side of natural oxide film detachment in accordance with the molecular beam epitaxial growing technique to thereby achieve an increase of substrate density. Thus, there can be accomplished on-site formation of a circuit pattern having the crystal film thickness along the direction of crystal growth uniformalized on the order of nanometers.
机译:用任意电子控制的电子束照射形成在AlxGayIn1-x-yAszP1-z(0≤x≤1、0≤y和z≤1)的包括单质GaAs和InP的基板表面上的薄膜表面。束直径和电流密度,以使在GaAs表面上形成的任何天然氧化膜都可以选择性地被Ga2O3取代或形成。此后,将衬底的温度调节到给定温度,以便在除Ga 2 O 3取代区域之外的区域实现自然氧化物膜的分离。根据分子束外延生长技术,在其自然氧化膜分离的一侧的衬底上进行III-V族化合物半导体晶体的选择性生长,从而实现衬底密度的增加。因此,可以实现现场形成电路图案,该电路图案具有沿着晶体生长方向的晶体膜厚度均匀化在纳米量级的电路图案。

著录项

  • 公开/公告号EP1739728A4

    专利类型

  • 公开/公告日2011-06-22

    原文格式PDF

  • 申请/专利权人 RIBER;

    申请/专利号EP20040727145

  • 申请日2004-04-13

  • 分类号H01L21/02;H01L21/20;H01L21/203;H01S5/34;

  • 国家 EP

  • 入库时间 2022-08-21 17:59:08

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