ALKALI-SOLUBLE RESIN CONTAINING SILICONE RESIN, LIGHT-SENSITIVE RESIN COMPOSITION, AND CURED OBJECT USING LIGHT-SENSITIVE RESIN COMPOSITION

摘要

Disclosed is an alkali-soluble silicone resin that can be used in a light-sensitive resin composition that has excellent weather resistance, light resistance, and heat resistance, and wherein the formation of micropatterns is possible. Further disclosed is a light-sensitive resin composition utilizing same. The alkali-soluble resin is represented by general formula 1 and has a carboxylic acid residue and a polymerizable unsaturated group in each molecule (R1 represents a hydrocarbon group that has 1-10 carbon atoms; R2 represents a hydrocarbon that has 1-20 carbon atoms; an ethereal oxygen atom may be contained inside X, which represents a bivalent substituent group that may contain a heteroatom inside, and Y, which represents a substituent group wherein a group containing a polymerizable double bond and a carboxyl group is bonded to an isocyanuric ring skeleton; Z represents a substituent group wherein a group containing a polymerizable double bond and a carboxyl group is bonded to a hydrogen atom or an isocyanuric ring skeleton; and m, n, and p independently represent a number from 0-100), and in addition to the abovementioned resin, the light-sensitive resin composition contains a photoinitiator and a photopolymerizable monomer having at least one ethylenically unsaturated bond.