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AN ELECTRONIC INLAY MODULE FOR ELECTRONIC CARDS AND TAGS, ELECTRONIC CARD AND METHODS FOR MANUFACTURING SUCH ELECTRONIC INLAY MODULES AND CARDS
AN ELECTRONIC INLAY MODULE FOR ELECTRONIC CARDS AND TAGS, ELECTRONIC CARD AND METHODS FOR MANUFACTURING SUCH ELECTRONIC INLAY MODULES AND CARDS
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机译:用于电子卡和标签的电子镶嵌模块,电子卡以及制造这种电子镶嵌模块和卡的方法
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摘要
The disclosed electronic inlay (100) and the method of making such an electronic inlay includes a circuit board (10), a plurality of circuit components (20a-20c) attached to the circuit board, a bottom cover sheet (104), a top cover sheet (102), and a layer of thermosetting material (50) between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards (1) while using conventional equipment to apply top (40) and bottom (30) overlays to the electronic inlay.
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