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Graphene wafer, method for manufacturing the graphene wafer, method for releasing a graphene layer, and method for manufacturing a graphene device
Graphene wafer, method for manufacturing the graphene wafer, method for releasing a graphene layer, and method for manufacturing a graphene device
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机译:石墨烯晶片,制造石墨烯晶片的方法,用于释放石墨烯层的方法以及用于制造石墨烯器件的方法
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摘要
A method is used for releasing a graphene layer from a substrate. A graphene layer (111) is first formed on a surface of a first substrate (101). A metal layer (120) is then formed on a surface of the graphene layer. A pulling force is then applied to the metal layer to detach the graphene layer from the first substrate. The released graphene layer is bonded by intermolecular force onto a surface of a second substrate (130) separate from the first substrate or onto a surface of a bonding layer formed on the surface of the second substrate. The metal layer is then removed, by for example, etching.
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