CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM

摘要

Disclosed is a curable resin composition which exhibits high adhesion, high conduction reliability, excellent crack resistance and increased resistance to thermal shock or similar in high-temperature high-humidity environments. The curable resin composition contains an epoxy resin, and a curing agent for epoxy resin, and is characterised in that the difference between the maximum tanδ value in the viscoelastic spectrum and the tanδ value at -40˚C is at least 0.1.