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METHOD FOR PRODUCING WAFER LENS MEMBER, METHOD FOR PRODUCING IMAGE-CAPTURING LENS, METHOD FOR PRODUCING IMAGE-CAPTURING MODULE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE MOUNTED WITH IMAGE-CAPTURING MODULE
METHOD FOR PRODUCING WAFER LENS MEMBER, METHOD FOR PRODUCING IMAGE-CAPTURING LENS, METHOD FOR PRODUCING IMAGE-CAPTURING MODULE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE MOUNTED WITH IMAGE-CAPTURING MODULE
Disclosed is a method for producing an image-capturing lens, wherein the method is provided with a curing step for filling and curing a photo curable resin between a molding die having a lens-forming molding surface and one surface of a substrate, a releasing step for releasing, and a post-curing step for post-curing the lens portion formed on the substrate to progress the curing of the resin. The post-curing step is provided with a first post-curing step performed at a temperature from the glass-transition temperature (Tg) of the resin to Tg+100°C for 0.5 to 2 hours, and a second post-curing step performed at a temperature lower than the Tg and lower than the post-curing temperature in the first post-curing step by 25°C or more for 3 to 6 hours.
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