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SINK APPARATUS FOR GRINDING A HEAT TRANSFER PLANE, FOR SECURING THE HIGH THERMO-ELECTRIC EFFECT BY INCREASING THE GRINDING METHOD AND A FACILITY THEREOF
SINK APPARATUS FOR GRINDING A HEAT TRANSFER PLANE, FOR SECURING THE HIGH THERMO-ELECTRIC EFFECT BY INCREASING THE GRINDING METHOD AND A FACILITY THEREOF
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机译:用于研磨传热平面的辛克设备,用于通过增加研磨方法及其装置来确保较高的热电效应
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摘要
PURPOSE: A sink apparatus for grinding a heat transfer plane, for securing the high thermo-electric effect by increasing the grinding method and a facility thereof, are provided to increase the heat-conductive efficiency by increasing the contact surface between heating electronic products.;CONSTITUTION: A sink apparatus for grinding a heat transfer plane comprises a grinder(10) and a fixing member(20). The grinder has a grinding base part(11). A heat transfer part is installed in the fixing member. The heat transfer part comprises a heat transfer plane. An abrasive material(132) is inserted between the grinding base part and heat transfer plane.;COPYRIGHT KIPO 2011
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