首页> 外国专利> SINK APPARATUS FOR GRINDING A HEAT TRANSFER PLANE, FOR SECURING THE HIGH THERMO-ELECTRIC EFFECT BY INCREASING THE GRINDING METHOD AND A FACILITY THEREOF

SINK APPARATUS FOR GRINDING A HEAT TRANSFER PLANE, FOR SECURING THE HIGH THERMO-ELECTRIC EFFECT BY INCREASING THE GRINDING METHOD AND A FACILITY THEREOF

机译:用于研磨传热平面的辛克设备,用于通过增加研磨方法及其装置来确保较高的热电效应

摘要

PURPOSE: A sink apparatus for grinding a heat transfer plane, for securing the high thermo-electric effect by increasing the grinding method and a facility thereof, are provided to increase the heat-conductive efficiency by increasing the contact surface between heating electronic products.;CONSTITUTION: A sink apparatus for grinding a heat transfer plane comprises a grinder(10) and a fixing member(20). The grinder has a grinding base part(11). A heat transfer part is installed in the fixing member. The heat transfer part comprises a heat transfer plane. An abrasive material(132) is inserted between the grinding base part and heat transfer plane.;COPYRIGHT KIPO 2011
机译:目的:提供一种用于研磨传热平面的水槽装置,其通过增加研磨方法来确保高热电效应,并且其设备被设置为通过增加加热电子产品之间的接触面来提高导热效率。构成:用于研磨传热平面的水槽装置,包括研磨机(10)和固定构件(20)。研磨机具有研磨基础部分(11)。传热部分安装在固定构件中。传热部分包括传热平面。研磨材料(132)插入研磨基座部件和传热平面之间。; COPYRIGHT KIPO 2011

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