ADHESIVE COMPOSITION CONTAINING A THERMOPLASTIC RESIN, RADICAL POLYMERIC COMPOUND, DENDRITIC COMPOUND, AND RADICAL POLYMERIZATION INITIATOR, AND A CONNECTION STRUCTURE FOR A CIRCUIT MEMBER USING THE ADHESIVE COMPOSITION

摘要

PURPOSE: An adhesive composition and a connection structure for a circuit member using the adhesive composition are provided to obtain excellent adhesive strength in a curing condition of short time and low temperature.;CONSTITUTION: An adhesive composition includes a thermoplastic resin, a radical polymeric compound, a dendritic compound which is connected to a core part in order to dendritic-branch a branched part and has a terminal part at the end of the branched part, and a radical polymerization initiator. The average molecular weight of the dendritic compound is 1000 or more and less than 10000.;COPYRIGHT KIPO 2011