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PRINTED CIRCUIT BOARD INCLUDING AN EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF CAPABLE OF MATCHING AN ACTIVE SIDE OF AN ELECTRONIC COMPONENT WITH ONE SIDE OF A BASE BOARD
PRINTED CIRCUIT BOARD INCLUDING AN EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF CAPABLE OF MATCHING AN ACTIVE SIDE OF AN ELECTRONIC COMPONENT WITH ONE SIDE OF A BASE BOARD
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机译:包括嵌入式电子元件的印刷电路板及其制造方法,其能够将电子元件的有效侧与基板的一侧匹配
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摘要
PURPOSE: A printed circuit board including an embedded electronic component and manufacturing method thereof are provided to eliminate a need of additionally processing a via hole, thereby removing a laser process. ;CONSTITUTION: A base board(110) includes a cavity in a thickness direction. An electronic component(120) is arranged in the cavity to match an active side with one side of the base board. An insulating material(130) is laminated on the other side of the base board. An electronic component is buried in the other side of the base board. A first circuit layer(140) is formed on one side of the base board. The first circuit layer includes a connection pattern connected to a connection terminal.;COPYRIGHT KIPO 2011
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