首页> 外国专利> PRINTED CIRCUIT BOARD INCLUDING AN EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF CAPABLE OF MATCHING AN ACTIVE SIDE OF AN ELECTRONIC COMPONENT WITH ONE SIDE OF A BASE BOARD

PRINTED CIRCUIT BOARD INCLUDING AN EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF CAPABLE OF MATCHING AN ACTIVE SIDE OF AN ELECTRONIC COMPONENT WITH ONE SIDE OF A BASE BOARD

机译:包括嵌入式电子元件的印刷电路板及其制造方法,其能够将电子元件的有效侧与基板的一侧匹配

摘要

PURPOSE: A printed circuit board including an embedded electronic component and manufacturing method thereof are provided to eliminate a need of additionally processing a via hole, thereby removing a laser process. ;CONSTITUTION: A base board(110) includes a cavity in a thickness direction. An electronic component(120) is arranged in the cavity to match an active side with one side of the base board. An insulating material(130) is laminated on the other side of the base board. An electronic component is buried in the other side of the base board. A first circuit layer(140) is formed on one side of the base board. The first circuit layer includes a connection pattern connected to a connection terminal.;COPYRIGHT KIPO 2011
机译:目的:提供一种包括嵌入式电子部件的印刷电路板及其制造方法,以消除对额外处理过孔的需要,从而消除了激光工艺。 ;构成:基板(110)在厚度方向上具有空腔。电子部件(120)布置在空腔中,以使有源侧与基板的一侧匹配。绝缘材料(130)被层压在基板的另一侧上。电子组件埋在基板的另一侧。在基板的一侧上形成第一电路层(140)。第一电路层包括连接到连接端子的连接图案。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20110061221A

    专利类型

  • 公开/公告日2011-06-09

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRO-MECHANICS CO. LTD.;

    申请/专利号KR20090117807

  • 发明设计人 JEONG TAE SUNG;KIM HONG WON;

    申请日2009-12-01

  • 分类号H05K3/30;

  • 国家 KR

  • 入库时间 2022-08-21 17:51:46

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