SEMICONDUCTOR PACKAGE FOR VERTICAL AND HORIZONTAL MOUNT AND MANUFACTURING METHOD THEREOF CAPABLE OF FUSING A SOLDER BALL ON THE CONNECTION UNIT OF A MOTHER BOARD OF AN MEMS SENSOR

摘要

PURPOSE: A semiconductor package for vertical and horizontal mount and a manufacturing method thereof are provided to accurately detect acceleration or angular velocity in x, y, and z axial directions by vertically or horizontally mounting the semiconductor package in an acceleration or angular velocity sensor.;CONSTITUTION: A substrate has a plurality of package unit areas. A sawing line is formed in the border of each package unit. A MEMS chip and an ASIC chip are mounted on a chip attaching area divided in each package unit area. A wire is connected between a conductive pattern of a chip mounting area, the MEMS chip, and the ASIC chip. A ball land(16) is connected to the conductive pattern and is formed on the sawing line with a preset space. A solder ball(18) is fused on the ball land. Molding resin(40) is molded on the upper side of the substrate including the MEMS chip, the ASIC chip, and the solder ball.;COPYRIGHT KIPO 2012