首页> 外国专利> SILICONE RESIN COMPOSITION WITH EXCELLENT LIGHT-PROOF PROPERTY AND HEAT RESISTANCE, A SILICONE RESIN SHEET USING THE SAME, A SILICON RESIN HARDENED MATERIAL, AND AN OPTICAL SEMICONDUCTOR DEVICE

SILICONE RESIN COMPOSITION WITH EXCELLENT LIGHT-PROOF PROPERTY AND HEAT RESISTANCE, A SILICONE RESIN SHEET USING THE SAME, A SILICON RESIN HARDENED MATERIAL, AND AN OPTICAL SEMICONDUCTOR DEVICE

机译:具有优异的耐光性能和耐热性的硅树脂组合物,使用相同的硅树脂板,硅树脂硬化材料以及光学半导体器件

摘要

PURPOSE: A silicone resin composition is provided to form a semi-hardened state capable of the encapsulation processing of an optical semiconductor device.;CONSTITUTION: A silicone resin composition comprises: organopolysiloxane having a silanol group at the end thereof; organopolysiloxane having one or more alkenylsilyl groups in one molecule and two or more hydrosilyl groups; a condensation catalyst; and a hydrosilylation catalyst. The organopolysiloxane having a silanol group at the end thereof includes the compound represented by chemical formula (I). In chemical formula (I), R^1 is a monovalent hydrocarbon; and n is an integer of 1 or more.;COPYRIGHT KIPO 2012
机译:用途:提供一种有机硅树脂组合物,以形成能够对光半导体器件进行封装处理的半硬化状态。组成:一种有机硅树脂组合物,包括:在末端具有硅烷醇基的有机聚硅氧烷;在一个分子中具有一个或多个烯基甲硅烷基和两个或多个氢甲硅烷基的有机聚硅氧烷;缩合催化剂;和氢化硅烷化催化剂。在其末端具有硅烷醇基的有机聚硅氧烷包括由化学式(I)表示的化合物。在化学式(I)中,R ^ 1为一价烃; n为1或更大的整数。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20110118577A

    专利类型

  • 公开/公告日2011-10-31

    原文格式PDF

  • 申请/专利权人 NITTO DENKO CORPORATION;

    申请/专利号KR20110037611

  • 发明设计人 KATAYAMA HIROYUKI;

    申请日2011-04-22

  • 分类号C08L83/04;C08G77/04;C08G77/08;C08J5/18;

  • 国家 KR

  • 入库时间 2022-08-21 17:50:50

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