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SILICONE RESIN COMPOSITION WITH EXCELLENT LIGHT-PROOF PROPERTY AND HEAT RESISTANCE, A SILICONE RESIN SHEET USING THE SAME, A SILICON RESIN HARDENED MATERIAL, AND AN OPTICAL SEMICONDUCTOR DEVICE
SILICONE RESIN COMPOSITION WITH EXCELLENT LIGHT-PROOF PROPERTY AND HEAT RESISTANCE, A SILICONE RESIN SHEET USING THE SAME, A SILICON RESIN HARDENED MATERIAL, AND AN OPTICAL SEMICONDUCTOR DEVICE
PURPOSE: A silicone resin composition is provided to form a semi-hardened state capable of the encapsulation processing of an optical semiconductor device.;CONSTITUTION: A silicone resin composition comprises: organopolysiloxane having a silanol group at the end thereof; organopolysiloxane having one or more alkenylsilyl groups in one molecule and two or more hydrosilyl groups; a condensation catalyst; and a hydrosilylation catalyst. The organopolysiloxane having a silanol group at the end thereof includes the compound represented by chemical formula (I). In chemical formula (I), R^1 is a monovalent hydrocarbon; and n is an integer of 1 or more.;COPYRIGHT KIPO 2012
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