High temperature hardening epoxy resin composition for adhesives, the method of manufacturing the resin composition, and the adhesive agent using the composition

摘要

PURPOSE: A high temperature curable epoxy resin compound for adhesive is provided to ensure excellent compatibility with epoxy resin, high electrically insulating property, high fluidity, and heat resistance and to obtain an adhesive usable for flexible display requiring high fluidity. CONSTITUTION: A high temperature curable epoxy resin compound for adhesive comprises an epoxy resin and copolymers bonded with a compound represented by chemical formula 2 at the end of polysiloxane represented by chemical formula 1. In chemical formula 1, R1 and R2 are independently -(CH2)-, -(CH2)xO(CH2)y- or -(CH2)aCO(CH2)b-; X, y, a and b are an integer; 0=x=50, 0=y=50, 0=a=50, 0=b=50; and 1=n=1,500.