Electrical contact element i.e. contact spring, cleaning method for testing chip modules, involves spraying electrical contact element with cleaning pressure jet containing solid cleaning agent and gaseous and/or liquid regulating agent

摘要

The method involves spraying an electrical contact element i.e. contact spring, with a cleaning pressure jet (25) containing a solid cleaning agent and a gaseous and/or liquid regulating agent, where the solid cleaning agent contains sodium carbonate. The solid cleaning agent and/or the liquid regulating agent are sprayed with a discharge pressure of 3 bar by a spraying unit (9) e.g. spray head, on the contact element. Distilled or ionized water is used as the liquid regulating agent. The regulating agent is used as a rinsing liquid. An independent claim is also included for a device for cleaning an electrical contact element.