首页> 外国专利> Method for the production of a coating having antireflexion layer on a movable substrate by a plasma-enhanced chemical vapor deposition, comprises providing a gas mixture having process-, carrier- and/or balance gas through a slit

Method for the production of a coating having antireflexion layer on a movable substrate by a plasma-enhanced chemical vapor deposition, comprises providing a gas mixture having process-, carrier- and/or balance gas through a slit

机译:通过等离子体增强化学气相沉积在可移动基板上生产具有抗反射层的涂层的方法,该方法包括通过狭缝提供具有工艺气体,载气和/或平衡气体的气体混合物

摘要

The method for the production of a coating having antireflexion layer on a movable substrate (30) by a plasma-enhanced chemical vapor deposition (PECVD), comprises providing a gas mixture having process-, carrier- and/or balance gas through a slit formed between two high-voltage electrodes (20) and producing plasma between a self-moving substrate that is supported by a counter electrode (50), and the high-voltage electrode. The plasma presets a plasma zone with standard, where the plasma is processed at atmospheric pressure and/or approximate atmospheric pressure. The method for the production of a coating having antireflexion layer on a movable substrate (30) by a plasma-enhanced chemical vapor deposition (PECVD), comprises providing a gas mixture having process-, carrier- and/or balance gas through a slit formed between two high-voltage electrodes (20) and producing plasma between a self-moving substrate that is supported by a counter electrode (50), and the high-voltage electrode. The plasma presets a plasma zone with standard, where the plasma is processed at atmospheric pressure and/or approximate atmospheric pressure and a volume dose of the plasma of 2x 10 5to 2x 10 7Ws/m 3is kept in the plasma zone. The plasma zone is worked with dielectric barrier discharge. The gas speed of the gas mixture is selected so that a time spent of the plasma in the plasma zone is 5-500 ms. The PECVD process is carried out so that the plasma zone comprises a pre-ionization area with decreased deposition rate and deposition area and the pre-ionization is partially carried out in gap. A reflection reduction is achieved to 2.5% in a wavelength range of 200 nm per coated substrate surface related to the uncoated substrate. The substrate has a reflexion reduction of 2.5% in the range of 300-1000 nm. A further layer is deposited on a layer that forms antireflexion layer. A layer influencing the wetting of the surface is deposited as a further layer. A layer improving the scraper stability of the surface is deposited as a further layer. The glass is float glass or cast glass. The substrate is optical transparent plastic. An independent claim is included for an antireflexion coating on a substrate.
机译:通过等离子体增强化学气相沉积(PECVD)在可移动基板(30)上生产具有抗反射层的涂层的方法包括通过形成的狭缝提供具有工艺气体,载气和/或平衡气体的气体混合物在两个高压电极(20)之间形成等离子体,并在由对电极(50)支撑的自移动基板和高压电极之间产生等离子体。等离子体预设具有标准的等离子体区域,在该区域中,等离子体在大气压和/或近似大气压下进行处理。通过等离子体增强化学气相沉积(PECVD)在可移动基板(30)上生产具有抗反射层的涂层的方法包括通过形成的狭缝提供具有工艺气体,载气和/或平衡气体的气体混合物在两个高压电极(20)之间形成等离子体,并在由对电极(50)支撑的自移动基板和高压电极之间产生等离子体。血浆预设了一个带有标准区域的血浆,在该区域中,血浆是在大气压和/或大约大气压下进行处理的,血浆中的血浆剂量为2x 10 5 2x 10 7> Ws / m 3>。区。等离子体区通过电介质势垒放电工作。选择气体混合物的气体速度,使得等离子体在等离子体区中花费的时间为5-500ms。进行PECVD工艺使得等离子体区包括具有减小的沉积速率和沉积面积的预电离区域,并且预电离在间隙中部分地进行。在与未涂覆的基板有关的每个涂覆的基板表面上,在200nm的波长范围内,反射减少达到2.5%。基材在300-1000 nm范围内的反射率降低了2.5%。在形成抗反射层的层上沉积另一层。影响表面润湿的层被沉积为另一层。改善表面刮擦稳定性的层被沉积为另一层。玻璃是浮法玻璃或铸玻璃。基材是光学透明塑料。包括针对基材上的抗反射涂层的独立权利要求。

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