首页> 外国专利> Cooling body for use in electronic industry for discharging surplus heat from CPU, has set of ribs comprising holes that engage into pins of another set of ribs for permitting heat transfer from latter set of ribs to former set of ribs

Cooling body for use in electronic industry for discharging surplus heat from CPU, has set of ribs comprising holes that engage into pins of another set of ribs for permitting heat transfer from latter set of ribs to former set of ribs

机译:电子工业中用于从CPU释放多余热量的冷却体,具有一组肋,该肋包括孔,该孔接合到另一组肋的销中,以允许热量从后一组肋传递到前一组肋

摘要

The body has a set of cooling ribs (1) comprising base and support sections (11) and cooling rib sections (12). Another set of cooling ribs (2) is retained above the cooling rib sections at different heights. The latter set of cooling ribs comprises multiple mounting-passage holes that engage into upright pins (13) of the former set of cooling ribs for permitting heat transfer from the former set of cooling ribs to the latter set of cooling ribs. A thermal pipe is connected with the former set of cooling ribs and extended up to the latter set of cooling ribs.
机译:主体具有一组冷却肋(1),其包括基部和支撑部分(11)以及冷却肋部分(12)。另一组冷却肋(2)以不同的高度固定在冷却肋部分的上方。后一组冷却肋包括与前一组冷却肋的直立销(13)接合的多个安装通道孔,以允许热量从前一组冷却肋传递到后一组冷却肋。热管与前一组冷却肋连接,并延伸至后一组冷却肋。

著录项

  • 公开/公告号DE102009037914A1

    专利类型

  • 公开/公告日2011-02-24

    原文格式PDF

  • 申请/专利权人 HUANG TSUNG-HSIEN;

    申请/专利号DE20091037914

  • 发明设计人 HUANG TSUNG-HSIEN;

    申请日2009-08-19

  • 分类号F28F13;F28F3;H05K7/20;G06F1/20;H01L23/34;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:45

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