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Improved wafer - level - packaging (wlp) for improved temperature changes, - case test, - and high current application
Improved wafer - level - packaging (wlp) for improved temperature changes, - case test, - and high current application
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机译:改进的晶圆级-包装(wlp),以改善温度变化-案例测试-大电流应用
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摘要
Wlp - device, which with a flange-shaped ubm or an embedded part - solder ball; - ubm on the upper side of a circuit connection of the type of a copper column is provided.
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