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Electronic component for use dissipaters, has thermal interface inserted between two supports and constituted by composite materials including organic binder and ferromagnetic particles
Electronic component for use dissipaters, has thermal interface inserted between two supports and constituted by composite materials including organic binder and ferromagnetic particles
The component has a thermal interface inserted between two supports (S1, S2) i.e. dissipaters, and constituted by composite materials including an organic binder (L) and ferromagnetic particles (NS) such as nickel nanowires, iron/cobalt particles or alloy particles. The organic binder is heat-hardening polymer, thermoplastic, elastomer, paraffin, epoxy or acrylate. The particles include ferromagnetic core and a metallic shell, and include a central metallic part and ferromagnetic ends. One of the supports has an elementary electronic component overheated during functioning. An independent claim is also included for a method for fabricating an electronic component.
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