Fluid cooled heatsink, consisting of an electrical conductor and a ceramic substrate, having near identical coefficients of thermal expansion.

摘要

A heatsink assembly 10 for cooling a heated device 50 includes an electrically isolating layer 64 such as a ceramic substrate having a plurality of cooling fluid channels 26 integrated therein. The electrically isolating layer 64 includes a topside surface 66 and a bottomside surface 68. A layer of electrically conducting material 62 is bonded or brazed either to the topside or the bottomside surfaces 66, 68 of the electrically isolating layer 64. The electrically conducting material 62 and the electrically isolating layer 64 have substantially identical coefficients of thermal expansion. Preferably the fluid cooling consists of inlet and outlet plena (20, fig 2), inlet and outlet manifolds (16,18, fig 2) connected to the plena, and cooling fluid channels 26, of micro-channel to milli-channel dimensions in the electrically isolating layer 64 . The electrically isolating layer 64 preferably consists of a ceramic such as AIN, BeO, Si3N4and A12O3. The cooling channels in the electrically isolating layer may be arranged to be continuous or in the form of discreet arrays as shown in fig 5.