首页> 外国专利> METHODS OF MANUFACTURING OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID MODULE, AND OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID MODULE OBTAINED BY THE SAME

METHODS OF MANUFACTURING OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID MODULE, AND OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID MODULE OBTAINED BY THE SAME

机译:制造光电混合板和光电混合模块的方法,以及采用该方法制造的光电混合板和光电混合模块的方法

摘要

PROBLEM TO BE SOLVED: To provide methods of manufacturing an opto-electric hybrid board and an opto-electric hybrid module, which include an inspection step of allowing accurate and efficient measurement of a position of an optical waveguide, and to provide an opto-electric hybrid board and an opto-electric hybrid module which are obtained by these methods.;SOLUTION: The method of manufacturing an opto-electric hybrid board, the method of manufacturing an opto-electric hybrid module by the method of manufacturing an opto-electric hybrid board, and the opto-electric hybrid board and the opto-electric hybrid module manufactured by these methods are provided. The method of manufacturing an opto-electric hybrid board includes: a step (A) of patterning a dummy core together with a core pattern on one surface of a substrate having a lower clad formed thereon; a step (B) of forming a reflecting mirror on the core pattern and the dummy core; a step (C) of patterning, on the other surface of the substrate, a light shielding pattern in the vicinity of a projection region on which reflected light from the dummy core is projected by the reflecting mirror, together with an electrode pattern; and a step (D) of measuring an amount of displacement between the core pattern and the electrode pattern on the basis of the total amount of luminance of reflected light from the dummy core, which passes without being shielded.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供制造光电混合板和光电混合模块的方法,其包括允许精确和有效地测量光波导的位置的检查步骤,并提供光电通过这些方法获得的混合电路板和光电混合模块。解决方案:制造光电混合板的方法,制造光电混合模块的方法提供了通过这些方法制造的光电混合基板和光电混合模块。光电混合基板的制造方法包括以下步骤:(A)在形成有下部包层的基板的一个表面上,将虚设芯和芯图案一起构图;步骤(B),在芯图案和虚芯上形成反射镜;步骤(C),在基板的另一表面上,在由反射镜投射来自虚拟芯的反射光的投射区域附近,将遮光图案与电极图案一起图案化;步骤(D),其基于来自虚拟芯的反射光的总亮度来测量芯图案和电极图案之间的位移量,该反射光的亮度未经屏蔽而通过。;版权所有:(C)2012 ,JPO&INPIT

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