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PROPERTY EVALUATION METHOD FOR FLEXIBLE WIRING BOARD, AND REPEATED BENDING TEST DEVICE

机译:柔性接线板的性能评估方法及重复弯曲试验装置

摘要

PROBLEM TO BE SOLVED: To provide a bending property evaluation method for a flexible wiring board in which reproduced is a breakage of a flexible printed circuit (FPC) occurred when inserting the FPC into a female connector while repeatedly moving the male connector vertically by a hand.;SOLUTION: In the bending property evaluation method for a flexible wiring board, one end of a test piece of the flexible wiring board is loosely held, the other end of the test piece is held with a gap in a thickness direction, and the test piece is oscillated in both directions in the thickness direction about a center where no load is applied to the test piece.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种挠性电路板的弯曲性能评估方法,其中复制的是将FPC插入母连接器,同时用手反复垂直移动公连接器时发生的柔性印刷电路(FPC)断裂。解决方案:在挠性电路板的弯曲性能评估方法中,挠性电路板的测试件的一端松散地固定,测试件的另一端在厚度方向上留有间隙,并且试件在厚度方向上绕未施加载荷的中心在两个方向上振动。;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012098141A

    专利类型

  • 公开/公告日2012-05-24

    原文格式PDF

  • 申请/专利权人 JX NIPPON MINING & METALS CORP;

    申请/专利号JP20100245919

  • 发明设计人 YAMAJI TATSUYA;

    申请日2010-11-02

  • 分类号G01N3/32;H05K3/00;G01N3/20;

  • 国家 JP

  • 入库时间 2022-08-21 17:43:07

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